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ASFC4G31MA-51BIN - Alliance Memory

Description: eMMC 4GB, eMMC 5.1, 3V, Industrial Grade, 153ball FBGA Package (11.5x13mm) - A Die

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Symbol

ASFC4G31MA-51BIN - Alliance Memory - PCB symbol

PCB Footprints

ASFC4G31MA-51BIN - Alliance Memory PCB footprint - BGA - BGA - 153ball FBGA_2025-2.2

3D Models

ASFC4G31MA-51BIN - Alliance Memory - 3D model - BGA - 153ball FBGA_2025-2.2

Datasheet Download Datasheet
Stock & Prices Price & Stock for ASFC4G31MA-51BIN
Part Number ASFC4G31MA-51BIN
Manufacturer Alliance Memory
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 153ball FBGA_2025-2.2
Released Date Jan 4, 2026
Last Modified Date Jan 4, 2026 12:48 PM UTC
Pinout / Pin List Click Here (Member Only)

ASFC4G31MA-51BIN Details

Manufacturer Part Number:
ASFC4G31MA-51BIN
Rohs Code:
Yes
Part Life Cycle Code:
End Of Life
ECCN Code:
EAR99
HTS Code:
8542.32.00.51
Manufacturer:
Alliance Memory Inc
YTEOL:
0
Memory IC Type:
eMMC
Terminal Finish:
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

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ASFC4G31MA-51BIN Overview

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