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ASI4UE-G1-ST - Renesas Electronics

Description: The ASI4U is a next-generation CMOS integrated circuit for AS-i networks. This low-level field bus AS i (Actuator Sensor Interface) was designed for easy, safe, and cost-effective interconnection of sensors, actuators, and switches. It transports both power and data over the same two-wire unshielded cable.The ASI4U is used as part of a master or slave node and functions as an interface to the physical bus. It provides the power supply, physical data transfer, and communication protocol handling. The ASI4U i

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ASI4UE-G1-ST - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP
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ASI4UE-G1-ST - Renesas Electronics  - 3D model - Small Outline Packages - SSOP
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ASI4UE-G1-ST Details

  • Manufacturer Part Number:

    ASI4UE-G1-ST

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    PYG28

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    33.1 V

  • Supply Voltage-Min:

    16 V

  • Supply Voltage-Nom:

    30 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

ASI4UE-G1-ST Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for PCB layout and thermal management. It's essential to follow the guidelines to ensure optimal performance and thermal dissipation. Additionally, a thermal pad is recommended to improve heat dissipation.
  • The ASI4UE-G1-ST has an internal POR and BOD circuit. However, external components are required to implement a robust POR and BOD. Renesas provides application notes and reference designs for implementing POR and BOD circuits.
  • Renesas provides guidelines for EMC and EMI considerations in their application notes. It's essential to follow proper PCB layout, grounding, and shielding techniques to minimize EMI and ensure EMC compliance.
  • Renesas provides power management guidelines in their application notes. Techniques such as clock gating, voltage scaling, and power domain management can be used to optimize power consumption. Additionally, using the device's low-power modes and configuring the peripherals appropriately can help reduce standby current.
  • Renesas provides environmental specifications for the ASI4UE-G1-ST. It's essential to follow proper packaging, sealing, and conformal coating techniques to ensure the device operates reliably in harsh environments. Additionally, thermal management and humidity protection measures should be implemented.

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ASI4UE-G1-ST Overview

Use the download button to access the ASI4UE-G1-ST schematic symbol, PCB footprint, and 3D model.
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