The recommended land pattern for the ASMCI-0805-100M-T is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
Yes, the ASMCI-0805-100M-T is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
During reflow soldering, it's essential to follow the recommended reflow profile to prevent damage to the component. The peak temperature should not exceed 260°C, and the time above 235°C should be limited to 10-15 seconds. Additionally, the component should be placed on a flat, even surface to prevent warping or damage during the reflow process.
Yes, the ASMCI-0805-100M-T is compatible with lead-free soldering. The component is RoHS-compliant and can be soldered using lead-free solder alloys, such as SAC305 or Sn96.5Ag3Cu0.5.
The ASMCI-0805-100M-T should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be handled with care to prevent mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent damage from static electricity.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ASMCI-0805-100M-T Overview
Use the download button to access the ASMCI-0805-100M-T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ASMCI,
or try a keyword search, such as Fixed Inductors
