ASMPM-0806-2R2M-T footprint, schematic symbol and 3D model by ABRACON

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ASMPM-0806-2R2M-T Details

The recommended land pattern for the ASMPM-0806-2R2M-T is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
The ASMPM-0806-2R2M-T is rated for operation up to 125°C, but it's recommended to derate the component's power handling at higher temperatures. Consult the datasheet for specific derating information.
Yes, the ASMPM-0806-2R2M-T is compatible with lead-free soldering processes, including RoHS and WEEE compliant processes.
The typical tolerance for the inductance value of the ASMPM-0806-2R2M-T is ±10%.
The ASMPM-0806-2R2M-T is designed for high-frequency applications up to 1 GHz, but the component's performance may degrade at higher frequencies. Consult the datasheet for specific frequency response information.

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