ASPI-0312FS-2R2M-T2 footprint, schematic symbol and 3D model by ABRACON

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ASPI-0312FS-2R2M-T2 Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad and a minimum clearance of 0.2mm between pads.
Yes, the ASPI-0312FS-2R2M-T2 is rated for operation up to 125°C, but it's recommended to derate the power handling according to the temperature derating curve provided in the datasheet.
Abracon recommends following the IPC-J-STD-020 standard for moisture sensitivity, and storing the components in a dry environment with a relative humidity below 60%. Additionally, baking the components before reflow soldering can help to reduce the risk of moisture-related failures.
Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second maximum.
Yes, the ASPI-0312FS-2R2M-T2 is AEC-Q200 qualified, but it's recommended to consult with Abracon's application engineers to ensure that the specific design and application meet the AEC-Q200 requirements.

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