ASPI-0403-100K-T footprint, schematic symbol and 3D model by ABRACON

Symbol

PCB Footprints

ASPI-0403-100K-T Details

Abracon recommends a land pattern with a pad size of 0.55mm x 0.55mm and a spacing of 0.3mm between pads to ensure reliable soldering and minimize thermal resistance.
While the ASPI-0403-100K-T is rated for operation up to 125°C, it's recommended to derate the component's power handling by 50% when operating above 85°C to ensure reliability and prevent thermal damage.
Handle the component by the edges to prevent damage to the termination pads. Avoid touching the component's body or pads to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat if possible.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second to ensure reliable soldering and minimize thermal stress.
While the ASPI-0403-100K-T is designed to be robust, it's recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening method to prevent vibration-induced damage or detachment.

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Use the download button to access the ASPI-0403-100K-T schematic symbol and PCB footprint.

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