ASPI-0403-220K-T footprint, schematic symbol and 3D model by ABRACON

Symbol

PCB Footprints

ASPI-0403-220K-T Details

Abracon recommends a land pattern with a pad size of 0.55mm x 0.55mm and a spacing of 0.3mm between pads to ensure reliable soldering and minimize thermal resistance.
While the ASPI-0403-220K-T is rated for operation up to 125°C, it's recommended to derate the component's power handling by 50% when operating above 85°C to ensure long-term reliability.
To prevent moisture-related issues, it's recommended to store the ASPI-0403-220K-T in a dry environment (less than 30% RH) and bake the components at 125°C for 24 hours before reflow soldering.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a cooling rate of 4°C/second to minimize thermal shock and ensure reliable solder joints.
While the ASPI-0403-220K-T is designed to withstand moderate vibrations, it's recommended to perform additional testing and analysis to ensure the component's reliability in high-vibration applications.

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