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ASPI-0403S-682M-T - ABRACON

Description: 6.8 mH Shielded Wirewound Inductor 40 mA 25Ohm Max Nonstandard

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Symbol
ASPI-0403S-682M-T - ABRACON - PCB symbol
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PCB Footprints
ASPI-0403S-682M-T - ABRACON PCB footprint - Other - Other - 6.60mm x 4.45mm x 2.92mm_2025
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3D Models
ASPI-0403S-682M-T - ABRACON - 3D model - Other - 6.60mm x 4.45mm x 2.92mm_2025
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ASPI-0403S-682M-T Details

  • Manufacturer Part Number:

    ASPI-0403S-682M-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    2618

  • Construction:

    Rectangular

  • DC Resistance:

    25 Ω

  • Inductance-Nom (L):

    6800 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.92 mm

  • Package Length:

    6.6 mm

  • Package Style:

    SMT

  • Package Width:

    4.45 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    0.04 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPI-0403S-682M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 0.55mm x 0.55mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal stress.
  • While the ASPI-0403S-682M-T is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable performance in high-temperature environments.
  • Handle the component by the edges, avoid touching the pads, and use ESD protection during assembly to prevent damage. Also, ensure the PCB is clean and dry before assembly.
  • Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp rate of 3-4°C/second to ensure reliable soldering and minimize thermal stress.
  • While the ASPI-0403S-682M-T is designed to be robust, it's essential to consider the vibration specifications and ensure the component is properly secured to the PCB to prevent mechanical stress and damage.

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ASPI-0403S-682M-T Overview

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