ASPI-0628-101M-T1 footprint, schematic symbol and 3D model by ABRACON

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ASPI-0628-101M-T1 Details

Abracon recommends following the IPC-7351B standard for the PCB land pattern, with a minimum pad size of 1.3mm x 0.8mm and a non-solder mask defined (NSMD) pad shape.
To ensure proper thermal management, Abracon recommends using a thermal pad on the bottom of the device, and ensuring good airflow around the component. The thermal pad should be connected to a solid ground plane to dissipate heat effectively.
The ASPI-0628-101M-T1 is rated for operation from -40°C to +85°C, with a storage temperature range of -40°C to +125°C.
Yes, the ASPI-0628-101M-T1 is designed to withstand high-vibration environments, with a vibration resistance of 10G peak acceleration, 10-2000Hz frequency range, and 3-axis vibration testing.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 60-90 seconds.

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