ASPI-0628-4R7M-T1 footprint, schematic symbol and 3D model by ABRACON

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ASPI-0628-4R7M-T1 Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
While the ASPI-0628-4R7M-T1 is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable performance in high-temperature environments.
Handle the component by the edges, avoid touching the pads, and use ESD protection during assembly to prevent damage. Also, ensure the PCB is clean and dry before assembly.
Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second to ensure reliable soldering and minimize thermal stress.
While the ASPI-0628-4R7M-T1 is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure proper PCB design and assembly to minimize the risk of mechanical failure in high-vibration or high-shock environments.

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