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ASPI-0804T-220M-T - ABRACON

Description: 22 µH Unshielded Drum Core, Wirewound Inductor 2.6 A 85mOhm Max Nonstandard

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ASPI-0804T-220M-T - ABRACON - PCB symbol
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PCB Footprints
ASPI-0804T-220M-T - ABRACON PCB footprint - Other - Other - ASPI-0804T
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ASPI-0804T-220M-T Details

  • Manufacturer Part Number:

    ASPI-0804T-220M-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7

  • Case/Size Code:

    5137

  • Construction:

    Rectangular

  • DC Resistance:

    0.085 Ω

  • Inductance-Nom (L):

    22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    5.21 mm

  • Package Length:

    12.95 mm

  • Package Style:

    SMT

  • Package Width:

    9.4 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    2.6 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPI-0804T-220M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad and a minimum clearance of 0.2mm around the pad.
  • Yes, ASPI-0804T-220M-T is rated for operation up to 125°C, but it's recommended to derate the component according to the temperature derating curve provided in the datasheet.
  • Handle the component by the edges, avoid touching the pads, and use a no-clean or water-soluble flux to prevent damage to the component.
  • Abracon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a total process time of 60-90 seconds.
  • Yes, ASPI-0804T-220M-T is compatible with lead-free soldering, but it's recommended to follow the recommended soldering profile and ensure that the soldering process is optimized for lead-free solder.

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ASPI-0804T-220M-T Overview

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