Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
Yes, the ASPI-2010-6R8M-T is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and the system is designed to handle the increased thermal stress.
To ensure proper soldering, Abracon recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder paste with a melting point of 217°C to 220°C. It's also essential to follow the recommended soldering profile and avoid excessive soldering time.
Yes, the ASPI-2010-6R8M-T is compatible with lead-free soldering processes, such as SAC305 (Sn96.5-Ag3-Cu0.5) and is RoHS compliant.
Abracon recommends storing the ASPI-2010-6R8M-T in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. It's also essential to avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
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ASPI-2010-6R8M-T Overview
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