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ASPI-2012-6R8M-T - ABRACON

Description: Power Inductor, 6.8uh, 0.92a, 0.702a, Ferrite, ±20%, Shielded, 0.479 Ohm, 2.0x2.0x1.2, Smd

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Symbol
ASPI-2012-6R8M-T - ABRACON - PCB symbol
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PCB Footprints
ASPI-2012-6R8M-T - ABRACON PCB footprint - Other - Other - ASPI-2012-4R7M-T
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3D Models
ASPI-2012-6R8M-T - ABRACON - 3D model - Other - ASPI-2012-4R7M-T
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ASPI-2012-6R8M-T Details

  • Manufacturer Part Number:

    ASPI-2012-6R8M-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    0808

  • Construction:

    Rectangular

  • Core Material:

    NICKEL-ZINC FERRITE

  • DC Resistance:

    0.479 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    0.64 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

ASPI-2012-6R8M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
  • Yes, the ASPI-2012-6R8M-T is rated for operation up to 125°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the recommended specifications.
  • To ensure proper soldering, Abracon recommends using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point of 217°C to 221°C.
  • Yes, the ASPI-2012-6R8M-T is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable joints.
  • The typical power dissipation of the ASPI-2012-6R8M-T is 250mW. However, this value can vary depending on the operating frequency, voltage, and other application-specific factors.

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ASPI-2012-6R8M-T Overview

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