ASPI-M3015-2R2M-T footprint, schematic symbol and 3D model by ABRACON

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ASPI-M3015-2R2M-T Details

Abracon recommends a land pattern with a minimum pad size of 1.3mm x 0.8mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and to prevent solder bridging.
Yes, the ASPI-M3015-2R2M-T is designed to withstand high-vibration environments. It meets the IEC 60068-2-6 vibration test standard, which ensures reliable operation in applications with vibration levels up to 10g.
To ensure the ASPI-M3015-2R2M-T operates within its specified temperature range of -40°C to +85°C, make sure to provide adequate heat dissipation and avoid exposing the device to extreme temperatures during storage or operation.
Abracon recommends a soldering profile with a peak temperature of 260°C ± 5°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 90-120 seconds to ensure reliable solder joints.
Yes, the ASPI-M3015-2R2M-T is designed to operate in humid environments. It meets the IEC 60068-2-78 humidity test standard, which ensures reliable operation in environments with relative humidity up to 95%.

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