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ASPI-U252010-1R0M-T - ABRACON

Description: Inductor Power Shielded/Molded Wirewound 1uH 20% 100KHz 3.1A 0.05Ohm DCR 1008

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ASPI-U252010-1R0M-T - ABRACON - PCB symbol
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PCB Footprints
ASPI-U252010-1R0M-T - ABRACON PCB footprint - Other - Other - ASPI-U252010
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ASPI-U252010-1R0M-T Details

  • Manufacturer Part Number:

    ASPI-U252010-1R0M-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.8

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • DC Resistance:

    0.05 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    3.1 A

  • Self Resonance Frequency:

    54 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPI-U252010-1R0M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm and a spacing of 0.5mm between pads. The recommended land pattern is available in the Abracon Application Note AN-01.
  • Yes, ASPI-U252010-1R0M-T is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's specifications according to the temperature derating curve provided in the datasheet.
  • Handle the device by the package body only, avoiding touching the pins or the ceramic body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the device during assembly.
  • Abracon recommends a soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds. The recommended soldering profile is available in the Abracon Application Note AN-02.
  • Yes, ASPI-U252010-1R0M-T is designed to operate in humid environments. However, it's recommended to follow the IPC-J-STD-020 standard for moisture sensitivity and handling to prevent moisture-related failures.

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ASPI-U252010-1R0M-T Overview

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