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ASPIAIG-F5020-R68M-T - ABRACON

Description: Power Inductors - SMD FIXED IND 0.68UH 13.4A 10.2mOHM

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ASPIAIG-F5020-R68M-T - ABRACON - PCB symbol
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PCB Footprints
ASPIAIG-F5020-R68M-T - ABRACON PCB footprint - Other - Other - ASPIAIG-F5020-R68M-T-3
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ASPIAIG-F5020-R68M-T - ABRACON - 3D model - Other - ASPIAIG-F5020-R68M-T-3
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ASPIAIG-F5020-R68M-T Details

  • Manufacturer Part Number:

    ASPIAIG-F5020-R68M-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    2422

  • Construction:

    Molded

  • Core Material:

    ALLOY POWDER

  • DC Resistance:

    0.0102 Ω

  • Inductance-Nom (L):

    0.68 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.9 mm

  • Package Length:

    6 mm

  • Package Style:

    SMT

  • Package Width:

    5.7 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    13.4 A

  • Reference Standard:

    AEC-Q200; TS16949

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPIAIG-F5020-R68M-T Frequently Asked Questions (FAQs)

  • Abracon recommends following PCB land pattern: a rectangular pad with dimensions of 2.5mm x 1.3mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component centerline.
  • The ASPIAIG-F5020-R68M-T has a thermal resistance of 30°C/W. Ensure good thermal conduction by using a thermal pad or via to a ground plane. Keep the component away from heat sources and ensure good airflow.
  • Abracon recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes.
  • The ASPIAIG-F5020-R68M-T is designed to withstand vibrations up to 10G. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
  • Store the ASPIAIG-F5020-R68M-T in a dry, cool place with a temperature range of -40°C to 85°C and relative humidity below 80%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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ASPIAIG-F5020-R68M-T Overview

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