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ASPIAIG-S6055-4R7M-T - ABRACON

Description: 4.7µH Shielded Wirewound Inductor 4.25A 31mOhm Nonstandard

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ASPIAIG-S6055-4R7M-T - ABRACON - PCB symbol
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ASPIAIG-S6055-4R7M-T - ABRACON PCB footprint - Other - Other - ASPIAIG-S6055-4R7M-T-1
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ASPIAIG-S6055-4R7M-T - ABRACON - 3D model - Other - ASPIAIG-S6055-4R7M-T-1
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ASPIAIG-S6055-4R7M-T Details

  • Manufacturer Part Number:

    ASPIAIG-S6055-4R7M-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7.2

  • Case/Size Code:

    2424

  • Construction:

    Rectangular

  • Core Material:

    NICKEL-ZINC FERRITE

  • DC Resistance:

    0.031 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    5.5 mm

  • Package Length:

    6 mm

  • Package Style:

    SMT

  • Package Width:

    6 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    4.25 A

  • Reference Standard:

    AEC-Q200; TS16949

  • Self Resonance Frequency:

    24 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPIAIG-S6055-4R7M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm and a spacing of 0.5mm between pads. The recommended stencil aperture is 0.7mm x 0.5mm.
  • The ASPIAIG-S6055-4R7M-T is rated for operation up to 125°C, but it's recommended to derate the component's performance at temperatures above 85°C. Consult the datasheet for specific derating guidelines.
  • Handle the component by the edges to prevent damage to the pads or internal components. Avoid touching the pads or internal components to prevent electrostatic discharge (ESD) damage.
  • Abracon recommends a soldering profile with a peak temperature of 260°C and a dwell time of 10-30 seconds. The component should be soldered using a Pb-free solder alloy with a melting point of 217°C or higher.
  • The ASPIAIG-S6055-4R7M-T is designed to withstand moderate vibration, but it's recommended to consult Abracon's vibration testing guidelines to ensure the component meets the specific requirements of your application.

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ASPIAIG-S6055-4R7M-T Overview

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