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AT97SC3205-H3M4500B - Microchip

Description: 8-bit Microcontrollers - MCU Prod FF Ind SPI TPM 4x4 32VQFN SEK Bulk - Prod FF Ind SPI TPM 4x4 32VQFN CEK Bulk

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AT97SC3205-H3M4500B - Microchip - PCB symbol
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AT97SC3205-H3M4500B - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - AT97SC3205-H3M4500B
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AT97SC3205-H3M4500B - Microchip - 3D model - Quad Flat No-Lead - AT97SC3205-H3M4500B
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AT97SC3205-H3M4500B Details

  • Manufacturer Part Number:

    AT97SC3205-H3M4500B

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • Format:

    FIXED POINT

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    4 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

AT97SC3205-H3M4500B Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a reliable communication protocol such as SPI or I2C, and ensure that the clock frequency and data transfer rate are within the recommended specifications. Also, use a pull-up resistor on the SCL/SDA lines and a series resistor on the SCK line.
  • Power up the device in the following sequence: VDD, VDDIO, and then VREF. Ensure that VDD and VDDIO are powered up simultaneously, and VREF is powered up last.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device, and avoid blocking the airflow with components or obstacles. Also, use a thermal interface material to improve heat transfer.
  • Use 0.1uF to 1uF ceramic capacitors for decoupling, placed as close as possible to the power pins. Use a 10uF to 22uF electrolytic capacitor for bulk decoupling, placed near the power supply.

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AT97SC3205-H3M4500B Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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