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AT97SC3205T-U3A1C-20 - Microchip

Description: Trusted Platform Module 1.2, I2C Interface

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AT97SC3205T-U3A1C-20 - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-28LD-PL-1
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AT97SC3205T-U3A1C-20 Details

  • Manufacturer Part Number:

    AT97SC3205T-U3A1C-20

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    TSSOP-28

  • Country Of Origin:

    Philippines

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G28

  • Length:

    9.7 mm

  • Low Power Mode:

    NO

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

AT97SC3205T-U3A1C-20 Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout guide in their application note AN220, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • Microchip provides a secure boot implementation guide in their application note AN221, which includes steps for generating and verifying digital signatures, and implementing secure boot mechanisms using the device's built-in cryptographic engines.
  • The device has a maximum junction temperature of 150°C, and thermal management is critical to ensure reliable operation. Microchip recommends using thermal vias, thermal pads, and heat sinks to dissipate heat, and following the thermal management guidelines in the datasheet.
  • Microchip provides power management guidelines in their application note AN222, which includes techniques for reducing power consumption, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Microchip recommends following the EMC guidelines in the datasheet, including using shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure compliance with regulatory standards.

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AT97SC3205T-U3A1C-20 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image AT97SC3205T-X3A1C-20 Microchip Technology Inc

CMOS, PDSO28