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ATF-551M4-BLK - Avago Technologies

Description: RF Mosfet pHEMT FET 2.7 V 10 mA 2GHz 17.5dB 14.6dBm MiniPak 1412

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PCB Footprints
ATF-551M4-BLK - Avago Technologies PCB footprint - Other - Other - ATF-551M4-BLK-2
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3D Models
ATF-551M4-BLK - Avago Technologies  - 3D model - Other - ATF-551M4-BLK-2
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ATF-551M4-BLK Details

  • Manufacturer Part Number:

    ATF-551M4-BLK

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP CARRIER, R-XBCC-N4

  • Pin Count:

    4

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    5 V

  • Drain Current-Max (ID):

    0.1 A

  • FET Technology:

    HIGH ELECTRON MOBILITY

  • Highest Frequency Band:

    X BAND

  • JESD-30 Code:

    R-XBCC-N4

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.27 W

  • Power Gain-Min (Gp):

    15.5 dB

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

ATF-551M4-BLK Frequently Asked Questions (FAQs)

  • Broadcom provides a reference design guide for PCB layout and thermal management, which includes recommendations for thermal vias, heat sinks, and PCB stack-up. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • To minimize power consumption, ensure that the device is operated within the recommended voltage range, use the power-down mode when not in use, and optimize the clock frequency and voltage scaling. Additionally, consider using a low-power mode or dynamic voltage and frequency scaling (DVFS) to reduce power consumption.
  • To minimize EMI and RFI, ensure proper PCB layout, use shielding, and follow good design practices for signal routing and decoupling. Additionally, consider using EMI filters, chokes, or common-mode filters to reduce emissions.
  • Implement secure boot mechanisms, use secure firmware updates, and ensure that sensitive data is encrypted. Additionally, consider using secure protocols for communication and implement access controls to prevent unauthorized access.
  • Broadcom provides reliability data and MTBF estimates for the ATF-551M4-BLK. However, the actual reliability and MTBF can vary depending on the application, operating conditions, and quality of the PCB and manufacturing process.

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ATF-551M4-BLK Overview

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