ATSAM4CMP16CB-AUR - Microchip

ATSAM4CMP16CB-AUR Details

• Manufacturer Part Number:

  ATSAM4CMP16CB-AUR

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  LQFP-100

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  0

• JESD-30 Code:

  S-PQFP-G100

• JESD-609 Code:

  e3

• Length:

  14 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  100

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Equivalence Code:

  QFP100,.63SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.6 mm

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.08 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  14 mm

• uPs/uCs/Peripheral ICs Type:

  SoC