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ATTPM20P-H6MA1-10 - Microchip

Description: Trusted Platform Module 8-Pin UDFN EP T/R

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ATTPM20P-H6MA1-10 - Microchip - PCB symbol
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ATTPM20P-H6MA1-10 - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - ATTPM20P-H6MA1-10
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ATTPM20P-H6MA1-10 - Microchip - 3D model - Small Outline No-lead - ATTPM20P-H6MA1-10
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ATTPM20P-H6MA1-10 Details

  • Manufacturer Part Number:

    ATTPM20P-H6MA1-10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    UDFN-8

  • Country Of Origin:

    Taiwan, Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    34 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Bus Compatibility:

    SPI

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

ATTPM20P-H6MA1-10 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power consumption, use a heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials to improve heat transfer.
  • The recommended soldering conditions for the ATTPM20P-H6MA1-10 are a peak temperature of 260°C, a dwell time of 30 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 217°C or higher.
  • To troubleshoot issues with the device's power management features, use a logic analyzer or oscilloscope to monitor the device's power rails and control signals. Check the device's datasheet for specific troubleshooting guidelines and consult with Microchip's technical support team if necessary.
  • Using a different voltage regulator or power supply may affect the device's performance, power consumption, and thermal characteristics. Ensure that the alternative voltage regulator or power supply meets the device's power requirements and is compatible with the device's operating conditions.

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ATTPM20P-H6MA1-10 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image ATTPM20P-G6MA1-10 Microchip Technology Inc

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