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ATV02W150-HF - Comchip Technology

Description: 24.4V Clamp 8.2A Ipp Tvs Diode Surface Mount SOD-123F

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PCB Footprints
ATV02W150-HF - Comchip Technology PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123
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3D Models
ATV02W150-HF - Comchip Technology  - 3D model - Small Outline Diode Flat Lead - SOD-123
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ATV02W150-HF Details

  • Manufacturer Part Number:

    ATV02W150-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    18.5 V

  • Breakdown Voltage-Min:

    16.7 V

  • Breakdown Voltage-Nom:

    17.6 V

  • Clamping Voltage-Max:

    24.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    15 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ATV02W150-HF Frequently Asked Questions (FAQs)

  • The datasheet doesn't provide a specific layout recommendation, but it's essential to follow general guidelines for thermal vias, copper pours, and component placement to ensure efficient heat dissipation. A good practice is to create a thermal pad under the device and connect it to a copper pour on the bottom layer, and also to use thermal vias to dissipate heat to the top layer.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. The device is sensitive to temperature and moisture, so it's crucial to follow the recommended storage and handling procedures. Additionally, use a soldering iron with a temperature control and a flux that is compatible with the device's package.
  • The datasheet doesn't provide a specific voltage derating guideline, but as a general rule, it's recommended to derate the voltage by 10-20% to ensure reliable operation and to account for any voltage spikes or transients.
  • The ATV02W150-HF is a commercial-grade device, and its reliability and performance may not meet the requirements of high-reliability or automotive applications. It's recommended to consult with the manufacturer or a qualified reliability engineer to determine the device's suitability for such applications.
  • The datasheet doesn't provide specific ESD protection guidelines, but it's essential to follow standard ESD protection practices, such as using ESD-safe handling and storage procedures, and incorporating ESD protection devices or circuits in the design.

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