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ATV02W330B-HF - Comchip Technology

Description: ESD Suppressors / TVS Diodes 200W 33V BIDIRECTION AEC-Q101

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ATV02W330B-HF - Comchip Technology PCB footprint - Other - Other - SOD-123_2022
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ATV02W330B-HF - Comchip Technology  - 3D model - Other - SOD-123_2022
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ATV02W330B-HF Details

  • Manufacturer Part Number:

    ATV02W330B-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    3

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Peak Rev Power Dis-Max:

    1000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.4 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

ATV02W330B-HF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the device and use short, wide traces for the power lines.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use a thermal design that allows for adequate heat dissipation.
  • A low-ESR ceramic capacitor with a value of 10-22uF is recommended. The capacitor should be placed close to the device's input pins.
  • Use a shielded enclosure, keep the device and its associated components away from sensitive circuits, and use a common-mode choke or ferrite bead on the input lines.
  • The device has built-in short-circuit protection. In the event of a short circuit, the device will limit the output current and then shut down if the short circuit persists.

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ATV02W330B-HF Overview

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