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AUIR08152STR - Infineon

Description: Infineon AUIR08152STR MOSFET Power Driver, -10 A, 10 A, 13 → 25 V, Non-Inverting, SOIC 8-Pin

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PCB Footprints
AUIR08152STR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC-ren1
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AUIR08152STR - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC-ren1
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AUIR08152STR Details

  • Manufacturer Part Number:

    AUIR08152STR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Driver Number of Bits:

    1

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    10 A

  • Output Peak Current Limit-Nom:

    10 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    15 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    25 V

  • Supply Voltage1-Min:

    15 V

  • Supply Voltage1-Nom:

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.35 µs

  • Turn-on Time:

    0.35 µs

  • Width:

    3.9 mm

AUIR08152STR Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • The maximum allowed voltage transient on the input pins is 40 V for a duration of less than 100 ns. Exceeding this may cause damage to the device.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure proper grounding and decoupling of the device.
  • A ceramic capacitor with a value of 10-22 μF and a voltage rating of at least 50 V is recommended. The capacitor should be placed as close as possible to the device's input pins.

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