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AUIRS2012STR - Infineon

Description: 200V High Side and Low Side Gate Driver packaged in 8-Lead SOIC package

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AUIRS2012STR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC_1
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AUIRS2012STR - Infineon  - 3D model - Small Outline Packages - 8 Lead SOIC_1
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AUIRS2012STR Details

  • Manufacturer Part Number:

    AUIRS2012STR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Built-in Protections:

    UNDER VOLTAGE

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.12 µs

  • Turn-on Time:

    0.12 µs

  • Width:

    3.9 mm

AUIRS2012STR Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • When selecting a gate driver for the AUIRS2012STR, consider the driver's output current capability, voltage rating, and propagation delay. Infineon recommends using their EiceDRIVER™ gate driver family, which is specifically designed for their IGBTs.
  • Although not explicitly stated in the datasheet, Infineon recommends limiting voltage transients to ±10% of the maximum rated voltage to ensure reliable operation and prevent damage to the device.
  • Implement a suitable overcurrent protection circuit, such as a desaturation detector or a current sense resistor, to detect and respond to overcurrent conditions. Additionally, ensure that the system's thermal design can handle the maximum allowed junction temperature during fault conditions.
  • Follow Infineon's recommended storage and handling guidelines, which include storing the devices in their original packaging, avoiding exposure to moisture and extreme temperatures, and handling the devices by the body rather than the leads to prevent damage.

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