Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm to 0.5 mm is recommended.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface material selection, and PCB layout. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
When selecting a gate driver for the AUIRS2123STR, critical parameters to consider include the driver's output current capability, rise and fall times, and the ability to handle the device's input capacitance. Additionally, consider the driver's voltage rating, propagation delay, and the number of outputs required.
To troubleshoot issues with the AUIRS2123STR, start by verifying the power supply voltage, checking for proper PCB layout and thermal design, and ensuring correct gate driver selection. Use oscilloscopes and logic analyzers to monitor the device's inputs and outputs, and consult Infineon's application notes and technical support resources as needed.
To ensure EMI and EMC compliance when using the AUIRS2123STR, consider the device's switching frequency, PCB layout, and component selection. Implement proper shielding, filtering, and grounding techniques, and follow Infineon's guidelines for EMI reduction. Additionally, consult relevant industry standards and regulations, such as CISPR and IEC.
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AUIRS2123STR Overview
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