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AUIRS2181STR - Infineon

Description: Driver 600V 2.3A 2-OUT Hi/Lo Side Non-Inv Automotive 8-Pin SOIC T/R

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AUIRS2181STR - Infineon - PCB symbol
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PCB Footprints
AUIRS2181STR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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AUIRS2181STR - Infineon - 3D model - Small Outline Packages - 8 Lead SOIC HEIGHT 1.75
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AUIRS2181STR Details

  • Manufacturer Part Number:

    AUIRS2181STR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Country Of Origin:

    Malaysia, Taiwan, Uk

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    TRANSIENT; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.33 µs

  • Turn-on Time:

    0.27 µs

  • Width:

    3.9 mm

AUIRS2181STR Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • Infineon recommends a gate drive voltage of 12-15 V for optimal performance and to ensure reliable switching. A higher gate drive voltage can improve switching speed, but may also increase power consumption.
  • Use a voltage regulator or a voltage supervisor to ensure the input voltage remains within the recommended operating range of 8-18 V. Additionally, consider using a transient voltage suppressor (TVS) to protect against voltage spikes and surges.
  • Infineon recommends a dead time of 100-200 ns for the high-side switch and 50-100 ns for the low-side switch to ensure reliable operation and minimize shoot-through currents.

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AUIRS2181STR Overview

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