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AWSCR-3.58CPLA-C30-T4 - ABRACON

Description: 3.58 MHz Ceramic Resonator Built in Capacitor 30 pF ±0.3% 30 Ohms -40°C ~ 85°C Surface Mount

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Symbol
AWSCR-3.58CPLA-C30-T4 - ABRACON - PCB symbol
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PCB Footprints
AWSCR-3.58CPLA-C30-T4 - ABRACON PCB footprint - Other - Other - AWSCR-3.58CPLA-C30-T4-2
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3D Models
AWSCR-3.58CPLA-C30-T4 - ABRACON - 3D model - Other - AWSCR-3.58CPLA-C30-T4-2
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AWSCR-3.58CPLA-C30-T4 Details

  • Manufacturer Part Number:

    AWSCR-3.58CPLA-C30-T4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    6

  • Crystal/Resonator Type:

    CERAMIC RESONATOR

  • Frequency Stability:

    0.3%

  • Frequency Tolerance:

    5000 ppm

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Frequency-Nom:

    3.58 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Physical Dimension:

    3.2mm x 1.3mm x 1.0mm

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER OVER NICKEL

AWSCR-3.58CPLA-C30-T4 Frequently Asked Questions (FAQs)

  • The recommended storage condition for the AWSCR-3.58CPLA-C30-T4 is in a dry, cool place, away from direct sunlight, with a temperature range of -40°C to 85°C and humidity below 80%.
  • Yes, the AWSCR-3.58CPLA-C30-T4 is designed to withstand high-vibration environments, with a vibration frequency range of 10-2000 Hz and an acceleration of 10G.
  • Yes, the AWSCR-3.58CPLA-C30-T4 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
  • The typical power consumption of the AWSCR-3.58CPLA-C30-T4 is 10mW, with a maximum power consumption of 20mW.
  • Yes, the AWSCR-3.58CPLA-C30-T4 is designed to operate in high-temperature environments, with an operating temperature range of -40°C to 125°C.

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AWSCR-3.58CPLA-C30-T4 Overview

Use the download button to access the AWSCR-3.58CPLA-C30-T4 schematic symbol, PCB footprint, and 3D model.
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