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AXE634124 - Panasonic

Description: Conn Fine Pitch Connector PL 34 POS 0.4mm Solder ST Top Entry SMD Reel

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AXE634124 - Panasonic PCB footprint - Other - Other - AXE634124
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AXE634124 Details

  • Manufacturer Part Number:

    AXE634124

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    7.48

  • Additional Feature:

    LOW PROFILE

  • Connector Type:

    FFC/FPC CONNECTOR

  • Contact Finish Mating:

    GOLD OVER NICKEL

  • Contact Finish Termination:

    GOLD OVER NICKEL

  • Contact Gender:

    MALE

  • Contact Material:

    COPPER ALLOY

  • DIN Conformance:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e4

  • MIL Conformance:

    NO

  • Mating Contact Pitch:

    0.016 inch

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number of Rows Loaded:

    2

  • Option:

    GENERAL PURPOSE

  • Terminal Pitch:

    0.4 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    34

  • UL Flammability Code:

    94V-0

AXE634124 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 10nF decoupling capacitor between VCC and GND.
  • Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range of -40°C to 125°C. Also, maintain the recommended voltage supply range of 2.7V to 5.5V.
  • The maximum allowable current for the I/O pins is 4mA. Exceeding this limit may cause damage to the device.
  • While the AXE634124 can operate up to 125°C, it's essential to consider the device's reliability and lifespan. Prolonged exposure to high temperatures can reduce the device's lifespan. Consider using a heat sink or thermal management system to maintain a safe operating temperature.
  • Use a logic analyzer or oscilloscope to monitor the communication signals. Check the signal integrity, clock frequency, and data transmission rates. Ensure the communication protocol is correctly implemented, and the device is properly configured.

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AXE634124 Overview

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