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AZ23C27-TP - MCC

Description: 300 mW Zener Diode 2.7 to 51 Volts

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PCB Footprints
AZ23C27-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
AZ23C27-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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AZ23C27-TP Details

  • Manufacturer Part Number:

    AZ23C27-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.95

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    80 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    250 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    27 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    7.03%

  • Working Test Current:

    5 mA

AZ23C27-TP Frequently Asked Questions (FAQs)

  • The recommended storage temperature for AZ23C27-TP is -40°C to 125°C.
  • Yes, AZ23C27-TP is compatible with lead-free soldering processes, making it suitable for RoHS-compliant designs.
  • The maximum power dissipation for AZ23C27-TP is 1.5W, and it's essential to ensure proper thermal management to prevent overheating.
  • Yes, AZ23C27-TP is designed for high-reliability applications, including aerospace, defense, and industrial control systems, due to its robust construction and high-quality materials.
  • Yes, AZ23C27-TP is available in tape and reel packaging, making it suitable for automated assembly and high-volume production.

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AZ23C27-TP Overview

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Part Image AZ23C27 Yangzhou Yangjie Electronics Co Ltd

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Part Image AZ23C27 Jiangsu Changjiang Electronics Technology Co Ltd

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Part Image AZ23C27 Lite-On Semiconductor Corporation

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