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AZ23C5V1-E3-18 - Vishay

Description: Zener Diodes 5.1 Volt 0.3W 5% CA

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Symbol
AZ23C5V1-E3-18 - Vishay - PCB symbol
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PCB Footprints
AZ23C5V1-E3-18 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 /2021
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3D Models
AZ23C5V1-E3-18 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 /2021
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AZ23C5V1-E3-18 Details

  • Manufacturer Part Number:

    AZ23C5V1-E3-18

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.95

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    60 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    480 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Voltage Temp Coeff-Max:

    0.4 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

AZ23C5V1-E3-18 Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for AZ23C5V1-E3-18 is -40°C to 125°C, as per Vishay's general guidelines for their Zener diodes.
  • Yes, the AZ23C5V1-E3-18 is suitable for high-reliability applications due to its construction and Vishay's quality control processes. However, it's essential to follow proper design, testing, and validation procedures to ensure the device meets the specific application requirements.
  • Follow standard soldering and assembly practices for through-hole devices. Ensure the device is handled by the body, not the leads, to prevent damage. Use a soldering iron with a temperature below 260°C, and avoid applying excessive force or bending the leads.
  • Yes, the AZ23C5V1-E3-18 is compatible with lead-free soldering processes, as it is a lead-free device. However, ensure that the soldering process temperature and profile are within the recommended specifications to prevent damage to the device.
  • The typical junction-to-ambient thermal resistance (RθJA) of the AZ23C5V1-E3-18 is around 200°C/W, but this value can vary depending on the specific application, board design, and environmental conditions.

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AZ23C5V1-E3-18 Overview

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