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AZ23C6V8-TP - MCC

Description: DIODE ZENER ARRAY 6.8V SOT23

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Symbol
AZ23C6V8-TP - MCC - PCB symbol
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PCB Footprints
AZ23C6V8-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
AZ23C6V8-TP - MCC - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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AZ23C6V8-TP Details

  • Manufacturer Part Number:

    AZ23C6V8-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-3

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.95

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    8 Ω

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    150 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    6.8 V

  • Reverse Current-Max:

    0.1 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5.88%

  • Working Test Current:

    5 mA

AZ23C6V8-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for AZ23C6V8-TP can be found in the IPC-7351 standard or by consulting with the manufacturer's application notes. A general guideline is to use a land pattern with a pad size of 0.8mm x 1.2mm and a spacing of 0.5mm between pads.
  • To handle thermal considerations, ensure that the device is mounted on a thermally conductive surface, and consider using thermal vias or thermal pads to dissipate heat. The device's thermal resistance (RθJA) is typically around 25°C/W, so ensure that your design can handle the expected power dissipation.
  • The recommended soldering profile for AZ23C6V8-TP is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds. Ensure that the soldering process is within the manufacturer's recommended specifications to prevent damage to the device.
  • While AZ23C6V8-TP is a high-quality device, it may not meet the specific requirements for high-reliability or aerospace applications. Consult with the manufacturer or a qualified reliability engineer to determine if the device meets the necessary standards and specifications for your application.
  • Ensure that the device is properly biased by following the recommended operating conditions outlined in the datasheet. This typically includes providing a stable input voltage, ensuring proper current limiting, and avoiding electrical overstress.

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AZ23C6V8-TP Overview

Use the download button to access the AZ23C6V8-TP schematic symbol, PCB footprint, and 3D model.
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