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B150-13-F - Diodes Incorporated

Description: Diodes Inc B150-13-F, SMT Schottky Diode, 50V 1A, 2-Pin DO-214AC

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B150-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - B1XX-13-F SMA
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B150-13-F - Diodes Incorporated  - 3D model - Diodes Moulded - B1XX-13-F SMA
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B150-13-F Details

  • Manufacturer Part Number:

    B150-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

B150-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the B150-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (pin 1) to a voltage source through a resistor (e.g., 1kΩ) and a capacitor (e.g., 10nF) in series. This helps to filter out noise and ensure a stable input voltage.
  • The B150-13-F is rated for operation from -40°C to 125°C. However, it's essential to consider the derating curves and thermal management to ensure reliable operation within the specified temperature range.
  • While the B150-13-F is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, it's crucial to consider the device's bandwidth, slew rate, and parasitic capacitance to ensure optimal performance.
  • To prevent electrostatic discharge (ESD) damage, handle the B150-13-F with an anti-static wrist strap or mat, and ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, near the device.

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B150-13-F Overview

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Part Image SS15-L Microsemi Corporation (now Microchip)

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Part Image SS15-LTS01 Microsemi Corporation (now Microchip)

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Part Image SS15-T3 Sangdest Microelectronics (Nanjing) Co Ltd

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For a full list of alternate parts for B150-13-F, check out Findchips.com