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B250-13-F - Diodes Incorporated

Description: Diodes Inc B250-13-F, SMT Schottky Diode, 50V 2A, 2-Pin DO-214AA

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B250-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMB_1
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B250-13-F - Diodes Incorporated  - 3D model - Diodes Moulded - SMB_1
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B250-13-F Details

  • Manufacturer Part Number:

    B250-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMB

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, HIGH RELIABILITY, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

B250-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the B250-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the output pin (VOUT) to a load or a voltage regulator. Ensure the input voltage is within the recommended operating range (2.5V to 5.5V) and the output current does not exceed the maximum rating (250mA).
  • The thermal resistance (RθJA) of the B250-13-F is 240°C/W. This means that for every 1W of power dissipation, the junction temperature will increase by 240°C. To ensure reliable operation, keep the device's operating temperature below the maximum rating (125°C) by providing adequate heat sinking or reducing power dissipation.
  • The B250-13-F is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. If your application requires operation above 85°C, consider using a heat sink or a thermally-enhanced package to maintain a safe operating temperature.
  • To protect the B250-13-F from overvoltage and overcurrent conditions, consider adding external protection components such as a voltage regulator, TVS diodes, or a fuse in series with the input pin. Additionally, ensure the input voltage does not exceed the maximum rating (5.5V) and the output current does not exceed the maximum rating (250mA).

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B250-13-F Overview

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For a full list of alternate parts for B250-13-F, check out Findchips.com