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B360-13-F - Diodes Incorporated

Description: DIODES INC. - B360-13-F - Schottky Rectifier, 60 V, 3 A, Single, DO-214AB (SMC), 2 Pins, 700 mV

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B360-13-F - Diodes Incorporated - PCB symbol
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PCB Footprints
B360-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AB, SMC
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3D Models
B360-13-F - Diodes Incorporated - 3D model - Diodes Moulded - DO-214AB, SMC
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B360-13-F Details

  • Manufacturer Part Number:

    B360-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMC

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6.22

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

B360-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the B360-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to minimize noise and ripple.
  • The B360-13-F is rated for operation in ambient temperatures ranging from -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures.
  • While the B360-13-F is a high-quality device, it is not specifically designed for high-reliability or automotive applications. For such applications, consider using devices with specific automotive or high-reliability certifications, such as AEC-Q100 or MIL-STD-883.
  • To prevent electrostatic discharge (ESD) damage, handle the B360-13-F with ESD-protective equipment, such as wrist straps, mats, or bags. Avoid touching the device's pins or exposed die, and ensure the device is stored in an ESD-protective package.

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B360-13-F Overview

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