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B360AE-13 - Diodes Incorporated

Description:  Reduced Low Forward Voltage Drop (VF); Better Efficiency and Cooler Operation  Reduced High-Temperature Reverse Leakage; Increased Reliability against Thermal Runaway Failure in High Temperature Operation.  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact u

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B360AE-13 - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMA
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B360AE-13 Details

  • Manufacturer Part Number:

    B360AE-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

B360AE-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the B360AE-13 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure reliable operation across the full temperature range (-40°C to 150°C), follow the recommended operating conditions, and consider the device's thermal characteristics. Ensure proper thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The B360AE-13 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or die.
  • Yes, the B360AE-13 is suitable for high-reliability and automotive applications. It meets the AEC-Q101 qualification standard, ensuring it can withstand the harsh conditions found in automotive environments.
  • The optimal input capacitor value depends on the specific application, output current, and input voltage ripple requirements. A general guideline is to use a capacitor with a value between 1-10 μF, with a voltage rating that exceeds the maximum input voltage. Consult the datasheet and application notes for more information.

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