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B360BE-13 - Diodes Incorporated

Description: Schottky Diodes & Rectifiers Schottky Rectifier

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B360BE-13 - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - B360BE-13
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B360BE-13 - Diodes Incorporated  - 3D model - Diodes Moulded - B360BE-13
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B360BE-13 Details

  • Manufacturer Part Number:

    B360BE-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMB, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

B360BE-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-ounce copper layer and to avoid routing high-current traces under the device.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid overheating the surrounding components.
  • The B360BE-13 has an ESD rating of Human Body Model (HBM) ≥ 2 kV and Machine Model (MM) ≥ 200 V. To prevent ESD damage, handle the device by the body or use an anti-static wrist strap. Store the device in an anti-static bag or wrap it in anti-static material. Avoid touching the pins or exposing the device to electrostatic charges during handling or assembly.
  • The B360BE-13 is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper design, testing, and validation. However, it's essential to consult with Diodes Incorporated or a qualified reliability engineer to ensure the device meets the specific requirements and standards of the application.
  • The recommended soldering technique for the B360BE-13 is reflow soldering with a peak temperature of 260°C. Use a solder paste with a melting point of 217°C to 221°C. Ensure the PCB is clean and dry before assembly, and avoid applying excessive force or pressure during the soldering process.

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B360BE-13 Overview

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