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B39921B4344P810 - RF360

Description: Signal Conditioning Cu Frame Filter 1411 915MHz 2.8dB QCS5P

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B39921B4344P810 - RF360 PCB footprint - Other - Other - B39921B4344P810-4
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3D Models
B39921B4344P810 - RF360  - 3D model - Other - B39921B4344P810-4
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B39921B4344P810 Details

  • Manufacturer Part Number:

    B39921B4344P810

  • Part Life Cycle Code:

    Contact Manufacturer

  • Manufacturer:

    RF360 Holdings Singapore Pte Ltd

  • Additional Feature:

    AEC-Q200; TR, 7 INCH

  • Center or Cutoff Frequency (fo/fc):

    915 MHz

  • Filter Type:

    SAW FILTER

  • Height:

    0.45 mm

  • Input Impedance:

    50 OHM

  • Insertion Loss-Max:

    4 dB

  • Length:

    1.4 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    50 OHM Ω

  • Width:

    1.1 mm

B39921B4344P810 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the B39921B4344P810 can be found in the RF360 Holdings Singapore Pte Ltd's application note or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To prevent damage, handle the B39921B4344P810 component by the body or the tabs, avoiding touching the pins or the electrical connections. Use anti-static wrist straps, mats, or tables to prevent electrostatic discharge (ESD) damage. Store the components in their original packaging or in a dry, ESD-protected environment.
  • The thermal resistance of the B39921B4344P810 is not explicitly stated in the datasheet. However, you can estimate it based on the package type and the thermal resistance of similar components. A higher thermal resistance can lead to increased temperatures, affecting the component's reliability and performance. Consider thermal management strategies, such as heat sinks or thermal interfaces, to mitigate this effect.
  • The B39921B4344P810 is designed to operate in a variety of environments, but high-vibration applications may require additional consideration. Ensure that your design takes into account the component's mechanical stress limits and that the PCB is properly secured to prevent damage. You may need to add mechanical support or use vibration-dampening materials to ensure reliable operation.
  • To troubleshoot issues with the B39921B4344P810, start by consulting the datasheet and application notes. Check for proper soldering, correct component orientation, and ensure that the component is operated within its specified ratings. Use diagnostic tools, such as oscilloscopes or logic analyzers, to identify signal integrity issues. If the problem persists, contact RF360 Holdings Singapore Pte Ltd's technical support or a qualified engineer for further assistance.

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