32 X 5.60 MM, 17 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4
Pin Count:
4
Country Of Origin:
India
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Diotec Semiconductor AG
YTEOL:
0
Configuration:
BRIDGE, 4 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF):
1 V
JESD-30 Code:
R-PSIP-W4
Non-rep Pk Forward Current-Max:
165 A
Number of Elements:
4
Number of Phases:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Output Current-Max:
5.8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
IN-LINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
80 V
Surface Mount:
NO
Terminal Form:
WIRE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
B40C5000-3300A Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 10mm x 10mm, using a 2oz copper thickness, and ensuring a good thermal connection to the heat sink or chassis.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.
The maximum allowed voltage transient for the B40C5000-3300A is 40V for a duration of 100ms, as specified in the datasheet. However, it's recommended to consult with Diotec Semiconductor AG for specific application requirements.
The B40C5000-3300A is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. For such applications, it's recommended to consult with Diotec Semiconductor AG for alternative devices or custom solutions that meet the required standards and qualifications.
The recommended storage and handling procedure for the B40C5000-3300A involves storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. It's also essential to follow proper ESD handling procedures to prevent damage during assembly and testing.
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B40C5000-3300A Overview
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