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B80C7000-4000A - Diotec

Description: Diotec bridge rectifier, 80 V, 160 V (RRM), 7 A, SIL, B80C7000-4000A

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B80C7000-4000A - Diotec PCB footprint - Other - Other - sil-2025-1
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B80C7000-4000A - Diotec  - 3D model - Other - sil-2025-1
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B80C7000-4000A Details

  • Manufacturer Part Number:

    B80C7000-4000A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    32 X 5.60 MM, 17 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Country Of Origin:

    India

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    0

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PSIP-W4

  • Non-rep Pk Forward Current-Max:

    275 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    160 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Reverse Test Voltage:

    160 V

  • Surface Mount:

    NO

  • Terminal Form:

    WIRE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

B80C7000-4000A Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 10mm x 10mm, and ensuring a solid copper fill on the top and bottom layers. Additionally, using thermal vias to connect the thermal pad to the bottom layer can help to dissipate heat more efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device.
  • The recommended soldering conditions for the B80C7000-4000A involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point above 217°C to ensure reliable connections.
  • To handle ESD protection during handling and assembly, it's essential to follow standard ESD precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging materials. Additionally, consider using ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge.
  • The recommended storage and handling conditions for the B80C7000-4000A involve storing the devices in their original packaging, in a dry and clean environment, with a temperature range of -40°C to 125°C and humidity below 60%. Avoid exposing the devices to direct sunlight, moisture, or mechanical stress.

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B80C7000-4000A Overview

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