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B82477P4472M000 - TDK

Description: SMD / SMT Inductors (Coils), L=4.7μH, 12.5mm x 12.5mm

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PCB Footprints
B82477P4472M000 - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - B82477P4
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3D Models
B82477P4472M000 - TDK  - 3D model - Inductors Precision Moulded - B82477P4
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B82477P4472M000 Details

  • Manufacturer Part Number:

    B82477P4472M000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.9

  • Case/Size Code:

    4949

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.012 Ω

  • Inductance-Nom (L):

    4.7 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    8.5 mm

  • Package Length:

    12.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.5 mm

  • Packing Method:

    TR, Blister, 13 Inch

  • Rated Current-Max:

    8.15 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

B82477P4472M000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for B82477P4472M000 can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout and dimensions for optimal performance and reliability.
  • Thermal management of B82477P4472M000 is crucial to ensure reliable operation. It is recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the component and the heat sink. The datasheet provides thermal resistance values, which can be used to estimate the junction temperature.
  • The moisture sensitivity level of B82477P4472M000 is typically MSL 3, which means it can withstand a maximum of 168 hours of exposure to moisture before soldering. It is recommended to follow the recommended storage and handling procedures to prevent moisture absorption.
  • B82477P4472M000 is designed to withstand certain levels of vibration, but it is recommended to consult the datasheet and application notes for specific vibration testing and qualification information. Additionally, it is recommended to perform vibration testing and analysis to ensure the component meets the required specifications.
  • To ensure the reliability of B82477P4472M000 in a high-temperature environment, it is recommended to follow the recommended operating temperature range, and to perform thermal analysis and testing to ensure the component meets the required specifications. Additionally, it is recommended to consider using a thermal protection device or a temperature sensor to monitor the temperature.

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B82477P4472M000 Overview

Use the download button to access the B82477P4472M000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like B8247, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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