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B82731M2701A030 - TDK

Description: Power Line Chokes, L=27mH Rated current=0.7A, LxWxT:21mmx15mmx20.5mm

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PCB Footprints
B82731M2701A030 - TDK PCB footprint - Other - Other - B82731M2801A030-2
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3D Models
B82731M2701A030 - TDK  - 3D model - Other - B82731M2801A030-2
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B82731M2701A030 Details

  • Manufacturer Part Number:

    B82731M2701A030

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1 Ω

  • Inductance-Nom (L):

    27000 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Lead Length:

    3 mm

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    20 mm

  • Package Length:

    21 mm

  • Package Style:

    PCB Mount

  • Package Width:

    15 mm

  • Packing Method:

    Tray

  • Rated Current-Max:

    0.7 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE IS MEASURED AT 0.1 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    RADIAL

  • Terminal Shape:

    FLAT

  • Test Frequency:

    0.01 MHz

  • Tolerance:

    50%

B82731M2701A030 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the B82731M2701A030 can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, solder mask, and soldering guidelines.
  • The B82731M2701A030 has a built-in EMI shield, but additional shielding measures may be necessary depending on the application and system requirements. Engineers should consider using additional shielding components, such as mu-metal or copper foil, and ensure proper grounding and connection to the PCB ground plane.
  • While the datasheet specifies the operating temperature range, engineers should note that the maximum operating temperature range may be affected by factors such as power dissipation, airflow, and surrounding component temperatures. It is recommended to consult with TDK Corporation's application engineers or perform thermal simulations to determine the optimal operating temperature range for the specific application.
  • The B82731M2701A030 is designed to meet certain vibration and shock requirements, but engineers should consult with TDK Corporation's application engineers to determine the suitability of the component for their specific application. Additional testing or customization may be necessary to ensure the component meets the required vibration and shock specifications.
  • To ensure the reliability and longevity of the B82731M2701A030, engineers should follow proper storage, handling, and soldering guidelines. Additionally, they should consider implementing design and testing procedures to mitigate potential failure mechanisms, such as thermal stress, electrical overstress, and mechanical stress.

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B82731M2701A030 Overview

Use the download button to access the B82731M2701A030 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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