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BA033CC0WFP-E2 - ROHM Semiconductor

Description: 1A 3.3V, Fixed Output LDO Regulator

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PCB Footprints
BA033CC0WFP-E2 - ROHM Semiconductor PCB footprint - Other - Other - TO252S-5
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3D Models
BA033CC0WFP-E2 - ROHM Semiconductor  - 3D model - Other - TO252S-5
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BA033CC0WFP-E2 Details

  • Manufacturer Part Number:

    BA033CC0WFP-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252

  • Package Description:

    TO-252, 5 PIN

  • Pin Count:

    4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    35 V

  • Input Voltage-Max:

    25 V

  • Input Voltage-Min:

    4 V

  • JESD-30 Code:

    R-PSSO-G5

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.1%

  • Load Regulation-Max:

    0.1%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP5H,.37,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2%

  • Width:

    5.5 mm

BA033CC0WFP-E2 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Use a stable power supply, ensure proper PCB layout, and consider using a thermal management solution such as a heat sink or thermal interface material.
  • The maximum allowable power dissipation is dependent on the ambient temperature and PCB layout. A general guideline is to keep the junction temperature below 150°C.
  • Yes, but ensure proper moisture protection measures are taken, such as conformal coating or potting, to prevent moisture ingress.
  • Check the power supply voltage, ensure proper PCB layout, and verify that the input and output pins are not short-circuited or damaged.

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BA033CC0WFP-E2 Overview

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