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BA033LBSG2-TR - ROHM Semiconductor

Description: Linear Voltage Regulators REG 3.3V 150MA

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PCB Footprints
BA033LBSG2-TR - ROHM Semiconductor PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23
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3D Models
BA033LBSG2-TR - ROHM Semiconductor  - 3D model - SOT23 (5-Pin) - SOT-23
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BA033LBSG2-TR Details

  • Manufacturer Part Number:

    BA033LBSG2-TR

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SSOP-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.15 V

  • Dropout Voltage1-Nom:

    0.09 V

  • Input Voltage Absolute-Max:

    9 V

  • Input Voltage-Max:

    7 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.03%

  • Load Regulation-Max:

    0.08%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.05 A

  • Output Voltage1-Max:

    3.382 V

  • Output Voltage1-Min:

    3.218 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.25 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2.484848%

  • Width:

    1.6 mm

BA033LBSG2-TR Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Monitor the input voltage, output current, and ambient temperature to ensure they are within the specified ranges. Also, ensure proper thermal management and PCB design.
  • A ceramic capacitor with a value of 1-10uF and a voltage rating of 6.3V or higher is recommended for input decoupling.
  • Check the input voltage, output current, and ambient temperature. Verify the PCB layout and thermal design. Use an oscilloscope to check for voltage ripple or oscillations.
  • Yes, ensure proper PCB layout and grounding to minimize EMI. Use a shielded inductor and consider adding EMI filters or shielding to the PCB design.

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BA033LBSG2-TR Overview

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