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BA10324AFV-E2 - ROHM Semiconductor

Description: ROHM BA10324AFV-E2, Quad Op Amp, 0.5MHz Push-Pull, 14-Pin SSOP-B

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BA10324AFV-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-B14
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3D Models
BA10324AFV-E2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SSOP-B14
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BA10324AFV-E2 Details

  • Manufacturer Part Number:

    BA10324AFV-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SSOP

  • Pin Count:

    14

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.25 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e2

  • Length:

    5 mm

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.25 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    32 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    500

  • Voltage Gain-Min:

    25118.9

  • Width:

    4.4 mm

BA10324AFV-E2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure stable operation with a single-supply voltage, ROHM recommends using a decoupling capacitor (e.g., 10uF) between VCC and GND, and a bypass capacitor (e.g., 100nF) between VCC and AVCC.
  • The maximum allowed power dissipation for the BA10324AFV-E2 is 500mW. Exceeding this limit may cause the device to overheat and malfunction.
  • The BA10324AFV-E2 is rated for operation up to 125°C. However, ROHM recommends derating the power dissipation by 50% for every 10°C above 85°C to ensure reliable operation.
  • ROHM recommends using ESD protection devices (e.g., TVS diodes) on the input pins to protect the BA10324AFV-E2 from electrostatic discharge. A minimum of 2kV ESD protection is recommended.

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