ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
ROHM recommends following the derating guidelines in the datasheet, ensuring proper heat sinking, and using a thermal interface material (TIM) to minimize thermal resistance.
The BA10339FV-E2 has built-in ESD protection diodes, but additional external protection may be necessary depending on the application. Latch-up prevention can be achieved by following proper PCB design and layout guidelines.
Yes, the BA10339FV-E2 is AEC-Q100 qualified, making it suitable for automotive applications. However, ensure compliance with specific automotive standards and regulations.
Store the BA10339FV-E2 in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to temperatures above 40°C or humidity above 80%.
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BA10339FV-E2 Overview
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