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BA4580RF-E2 - ROHM Semiconductor

Description: BA4580RF-E2 ROHM, Op Amp, 5 → 28 V, 8-Pin SOP

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BA4580RF-E2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP8_2022-1
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BA4580RF-E2 Details

  • Manufacturer Part Number:

    BA4580RF-E2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Nom:

    110 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Low-Offset:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Qualification Status:

    Not Qualified

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    31620

  • Width:

    4.4 mm

BA4580RF-E2 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and electromagnetic interference (EMI).
  • Monitor the input voltage, output current, and ambient temperature to ensure they are within the recommended ranges specified in the datasheet. Implement thermal management and overcurrent protection if necessary.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads. The device's thermal resistance (θja) is 25°C/W, so keep the ambient temperature below 85°C to prevent overheating.
  • Check the input voltage, output current, and ambient temperature. Verify the PCB layout and component placement. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, follow proper PCB layout and shielding techniques to minimize EMI. Use a metal shield or a shielded inductor to reduce radiated emissions. Ensure the device is placed away from sensitive analog circuits and antennas.

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BA4580RF-E2 Overview

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