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BALF-SPI-02D3 - STMicroelectronics

Description: 50 Ω nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter

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BALF-SPI-02D3 - STMicroelectronics - PCB symbol
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PCB Footprints
BALF-SPI-02D3 - STMicroelectronics PCB footprint - Other - Other - Chip Scale Package 0.4mm pitch_2022-3
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3D Models
BALF-SPI-02D3 - STMicroelectronics - 3D model - Other - Chip Scale Package 0.4mm pitch_2022-3
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BALF-SPI-02D3 Details

  • Manufacturer Part Number:

    BALF-SPI-02D3

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer Package Code:

    Chip Scale Package 0.4mm pitch

  • Country Of Origin:

    France

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • Cut-off Frequency-Max:

    434 MHz

  • Height:

    0.71 mm

  • Insertion Loss:

    -3.2 dB

  • JESD-609 Code:

    e1

  • Length:

    2.05 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Transformer Type:

    RF TRANSFORMER

  • Width:

    1.45 mm

BALF-SPI-02D3 Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a symmetrical and balanced PCB layout to minimize electromagnetic interference (EMI) and ensure optimal performance. A 50-ohm microstrip line with a 1.6 mm width and a 0.8 mm spacing is recommended.
  • The BALF-SPI-02D3 has a characteristic impedance of 50 ohms. To ensure optimal performance, the impedance of the PCB traces and the antenna should be matched to 50 ohms. You can use impedance calculators or consult with an RF engineer to determine the correct impedance for your specific application.
  • The BALF-SPI-02D3 can handle a maximum input power of +33 dBm (2W). Exceeding this power limit may cause damage to the component or affect its performance.
  • STMicroelectronics recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for 20-30 seconds. Ensure the component is properly aligned and the solder paste is evenly distributed to prevent solder bridges and ensure reliable connections.
  • The BALF-SPI-02D3 operates within a temperature range of -40°C to +85°C (-40°F to +185°F). Operating the component outside this range may affect its performance or reduce its lifespan.

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BALF-SPI-02D3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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