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BAS12507WH6327XTSA1 - Infineon

Description: Schottky Diodes & Rectifiers AF SCHOTTKY DIODE

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PCB Footprints
BAS12507WH6327XTSA1 - Infineon PCB footprint - Other - Other - PG-SOT343-4-3
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BAS12507WH6327XTSA1 Details

  • Manufacturer Part Number:

    BAS12507WH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-343, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    TR, 7 INCH: 3000

  • Application:

    FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-G4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    0.5 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Power Dissipation-Max:

    0.25 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    25 V

  • Reverse Current-Max:

    0.15 µA

  • Reverse Test Voltage:

    25 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

BAS12507WH6327XTSA1 Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for BAS12507WH6327XTSA1 is 1.71 V to 5.5 V.
  • Proper thermal management is crucial. Ensure good heat dissipation by using a heat sink, thermal interface material, and a well-designed PCB layout.
  • The maximum allowed power dissipation for BAS12507WH6327XTSA1 is 1.4 W. Exceeding this limit may cause damage to the device.
  • While the device can operate up to 150°C, it's essential to consider the derating curves and ensure the device doesn't exceed the maximum allowed junction temperature (Tj) of 150°C.
  • Follow proper PCB design guidelines, use shielding, and ensure good grounding to minimize electromagnetic interference (EMI) and ensure EMC compliance.

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BAS12507WH6327XTSA1 Overview

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